RF & Wireless Engineering Services
Vizmonet Services are designed to deliver complete wireless connectivity solutions tailored to industrial and OEM requirements. From concept to certification, we provide seamless support across every phase of wireless system development, ensuring performance, reliability, and compliance at scale.
Turnkey Manufacturing
- Vizmonet plays an active role in the manufacturing ecosystem and has a good network of component suppliers and contract manufacturers.
- Component Sourcing and procurement under AVL (Approved Vendor List)
- Full blown ERP system for EBOM, Procurement, Manufacturing, Quality & Shipping Management
PCB Assembly Manufacturing
- RoHS Assembly Line
- Surface mount Capability for 0201 foot prints
- N2 Reflow Soldering Capability
- AOI (Automatic Optical Inspection) & AXI (Automatic X-Ray Inspection)
- Micro BGA with 0.12 ball size on multi layer FPC
- Placing accuracy up to 30 micron.
- Flip chip (C4 Process)
- Package to package mounting process.
- 0201 RLC, ball grid arrays (BGA), fine pitch devices up to 70mm2.
- 24/7 production lines capable of handling high volume low complexity to low volume high complexity orders.
- Fully automated in-line optical inspection.
Capacity to populate usual PCB materials, plus-flexi, flexi rigid, aluminum & microwave substrates. - Flexible production lines (ESD Class 2A & 3A Certified)
Box Build Manufacturing
- RoHS Assembly Line
- Mechanical Components (Heatsink, Brackets etc.,) design and manufacturing
- Home-grown Test and Tools
- Centralized Data log system
- Remote monitoring of Production status
Regulatory Approvals
- FCC/IC/CE/JAPAN Certification support
- Geography specific Homologation
